March 14, 2025 — As global competition in the semiconductor industry intensifies, alliances and technological advancements are shaping the future of chip manufacturing. In a major development, nine European nations have formally signed an agreement to establish the Semiconductor Coalition, aiming to boost regional chip production and strengthen Europe's position in the global semiconductor supply chain. Meanwhile, Samsung Electronics has taken delivery of its first High-NA EUV lithography machine from ASML, a crucial step in advancing its 2nm manufacturing process.

Europe Forms Semiconductor Coalition to Strengthen Chip Industry

The newly formed Semiconductor Coalition consists of Germany, the Netherlands, France, Belgium, Finland, Italy, Austria, Poland, and Spain. The alliance covers the entire semiconductor value chain, from research and development to manufacturing and application. The initiative focuses on three key areas:

Technological Sovereignty: Advancing sub-2nm nodes, third-generation semiconductor materials, and AI chip architectures.

Supply Chain Resilience: Increasing local production, with a goal of raising Europe's automotive chip production capacity above 50%.

Innovation & Competitiveness: Strengthening industry-academia collaboration to accelerate technological commercialization.

This coalition is expected to enhance Europe's self-sufficiency in semiconductor manufacturing, reducing reliance on foreign suppliers. However, challenges remain, including potential conflicts of interest among member states. The Netherlands, home to ASML, prioritizes expanding equipment exports, while Germany seeks to enhance domestic chip production. Additionally, securing funding and skilled labor will be crucial for the coalition's success.

Despite these hurdles, Europe is committed to building a resilient semiconductor ecosystem through regulatory innovation and cross-border collaboration.

Samsung Expands 2nm Capabilities with High-NA EUV

In parallel with Europe's semiconductor push, Samsung Electronics has acquired its first High-NA EUV lithography machine—EXE:5000—from ASML at its Hwaseong facility in South Korea. The system, valued at approximately 500 billion KRW ($3.7 billion USD), marks a significant milestone in Samsung's roadmap for 2nm and beyond.

ASML's High-NA EUV technology increases numerical aperture (NA) from 0.33 to 0.55, dramatically improving lithographic precision. Compared to standard EUV tools, High-NA enables finer line widths, lower power consumption, and higher data processing speeds, making it essential for next-generation chip fabrication.

Samsung has been evaluating High-NA EUV applications since 2023 and plans to use the tool to build a comprehensive 2nm process ecosystem. Samsung Foundry's head, Han Jin-man, emphasized that while the company leads in Gate-All-Around (GAA) transistor technology, accelerating commercial 2nm production remains its top priority.

Global Race for High-NA EUV Adoption

The race to deploy High-NA EUV is heating up among semiconductor giants. Intel was the first to receive ASML's High-NA EUV machine in 2023 and has committed to acquiring a total of six units. According to reports, Intel's first two High-NA tools are already in production, processing 30,000 wafers per quarter.

Meanwhile, TSMC plans to introduce High-NA EUV for mass production by 2028, with EXE:5200 earmarked for Intel's 14A node.

Despite being the second-largest foundry in Q4 2023, Samsung's revenue declined 1.4% quarter-over-quarter to $3.26 billion, accounting for an 8.1% market share. In contrast, TSMC leads the global foundry market with a dominant 67% share.

A Transformative Phase for the Semiconductor Industry

With Europe's Semiconductor Coalition working to enhance regional self-sufficiency and Samsung accelerating its 2nm roadmap with High-NA EUV, the global semiconductor landscape is undergoing a pivotal transformation. As technological sovereignty and advanced manufacturing become key priorities, the coming years will determine which regions and companies emerge as dominant forces in the next-generation semiconductor race.