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Alongside 2.5D and 3D packaging technologies such as CoWoS and SoIC, glass substrate packaging is also gradually gaining prominence. Among packaging suppliers, the internal R&D production line of TSMC (2330.TW) demonstrates leading R&D capabilities. Meanwhile, Intel and Samsung hold leading positions in this field, both with significant plans for this technology - Intel plans to begin preliminary trials in 2025 and start mass production by 2026, while Samsung has announced at the 2024 CES conference that they also aim to realize the mass production of glass substrates by 2026.

The PCB equipment supplier E&R Engineering Corp. (8027.TW) is Intel's designated supplier of laser modification equipment, in marking, backline drawing, and slotting processes all are designated equipment suppliers for Intel, mainly providing Intel with laser and plasma equipment, and is currently the only equipment supplier in Taiwan.

Having already received successive orders, E&R Engineering Corp. is expected to start delivering equipment to Intel from the second half of this year, potentially leading to a new peak in their business next year.

Intel invested 1 billion USD in its factory in Arizona ten years ago to establish a research and development production line for glass substrates. As the production line gradually matured, the procurement and delivery of equipment have also begun. It is worth particular attention that, as a pioneer in the glass substrate industry, Intel has prepared its factories in Arizona and Malaysia, and the preliminary trial production equipment has already been put in place. Next, it will begin purchasing the equipment required for mass production.

About E&R Engineering Corp.

E&R Engineering Corp. established in 1994, is based in Yanchao District, Taiwan, offering high-quality products and solutions including laser processing, plasma cleaning, FPC equipment, and carrier packaging materials. E&R Engineering Corp.'s automation equipment is developed and produced in Taiwan, with branches or offices located in mainland China, Southeast Asia, and Europe and America.

Some of E&R Engineering Corp.'s FPC equipment:

Editor：Lulu

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