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On August 28, Taiwanese semiconductor and PCB equipment supplier E&R Engineering Corp.(8027.TW) hosted a joint conference on the "E-core System" with glass substrate suppliers.

The event attracted participation from 14 prominent Taiwanese companies, including Manz AG and Scientech (3583.TW) from the wet process field, AOI optical inspection provider Shyawei Optronics, coating specialists Linco Technology, STK, Skytech (6937.TW), Group Up (6664.TW), HIWIN (2049.TW), HMC (4576.TW), KEYENCE, Mirle (2464.TW), ACE PILLAR (8374.TW), CHYI DING and Coherent.

E&R Engineering's COO, Zhao Weike, stated that the formation of this alliance is just the beginning. The related equipment and materials for glass substrates are still under development, with small-scale production expected by 2026. The "E-Core System" initiative launched by E&R Engineering aims to collaborate with local leading companies to advance the core process technology of glass substrates, particularly Glass Core.

E&R Engineering highlighted that the glass substrate manufacturing process includes glass metallization, subsequent ABF lamination, and final glass substrate cutting. The Glass Core process involves critical technologies such as Through-Glass Via (TGV), wet etching, AOI optical inspection, sputtering, and plating.

The key to glass substrate technology lies in the initial glass laser modification (TGV). E&R Engineering has been collaborating with North American IDM clients for the past five years to develop TGV technology for glass laser modification. In 2023, the technology was validated, achieving drilling speeds of 8,000 holes per second or 600 to 1,000 holes with precision within ±5μm.

E&R Engineering is a designated supplier of laser modification equipment for Intel, providing laser and plasma equipment for processes such as marking, backside scribing, and slotting.

About E&R Engineering

Founded in 1994 and headquartered in Yanchao District, Taiwan, E&R Engineering specializes in providing high-quality products and solutions, including laser processing, plasma cleaning, FPC equipment, and carrier tape packaging. The company’s automated equipment is developed and manufactured in Taiwan, with branches and offices in Mainland China, Southeast Asia, Europe, and the United States.

Some of E&R Engineering's FPC equipment:

Editor：Lulu

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