The Taiwan Printed Circuit Association (TPCA) Show 2024, running from October 23 to 25 at the Taipei Nangang Exhibition Center, has brought together key industry players, including DuPont (NYSE: DD) and Doosan Corporation (KRX: 000150), to present their latest innovations in circuit materials and packaging solutions.

DuPont's Advanced Circuit Solutions

DuPont is showcasing its comprehensive range of advanced circuit materials, including solutions for fine line applications, advanced packaging, signal integrity, and thermal management. Positioned at Booth #K409, DuPont is also collaborating with industry leaders, such as TSMC and Samsung, during the IMPACT Conference session titled "Shaping Our Future with AI by Next-Gen Substrate and Packaging." Discussions center around the role of advanced materials in AI technologies and feature insights into the evolution of packaging solutions.

Yuan Yuan Zhou, Global Business Director for Advanced Circuit & Packaging at DuPont, highlighted that the company's innovations, including bump plating technologies and novel seed layer methods for glass substrates, are aimed at driving AI functionalities. DuPont’s technologies support increased I/O density, ensuring reliable, high-performance data processing — critical for AI applications.

Doosan’s High-End CCL Focus

Meanwhile, Doosan Corporation has reinforced its marketing efforts for high-end copper-clad laminates (CCL) at the TPCA Show, positioning itself as a major player in Taiwan’s rapidly growing PCB market. Doosan introduced its advanced CCL solutions for communication systems, optical modules, and semiconductor packaging, targeting high-speed data centers and AI-driven markets that demand rapid, reliable data transmission. The company also unveiled its AI accelerator CCL to meet the growing need for AI systems to perform core computational tasks accurately and swiftly.

Additionally, Doosan highlighted its MEMS Oscillator, developed in partnership with Canada’s Starseara, designed to generate internal signal frequencies for electronic devices and telecommunications systems. This product, slated for mass production in early 2025, showcases Doosan’s expertise in supporting emerging technologies in AI and high-speed communications.

Key Takeaways

Both DuPont and Doosan are focusing on critical themes at the TPCA Show — advanced packaging, signal integrity, and thermal management — underscoring their commitment to addressing the needs of AI, high-performance computing, and the ever-evolving semiconductor and electronics industries. Through their presentations, both companies aim to solidify their roles as leaders in the PCB and advanced packaging sectors, while attracting new customers in the Taiwanese market.

Attendees can visit DuPont and Doosan booths for further insights into their innovative solutions tailored to AI-driven applications and high-speed data transmission markets.