On February 24, the Printed Circuit Board Association of America (PCBAA) proudly announced the addition of DIS, Inc. to its growing roster of members. The company, headquartered in Islandia, New York, is renowned for its deep expertise in the PCB industry. The association expressed its excitement, noting that DIS's leadership and support are key to expanding the influence and reach of the PCBAA.
This announcement follows DIS’s growing global footprint, with the company recently reporting a major achievement in China. The PCB factory of 欣興電子 (Unimicron) in Kunshan has successfully completed the buy-off of DIS's OLS-D (pinless optical alignment & bonding) equipment. This cutting-edge technology is expected to significantly improve production yields and layer-to-layer accuracy, particularly for HDI PCBs, reinforcing DIS's reputation as a leader in PCB manufacturing solutions.
In a related update, DIS, Inc.'s Global Sales Director and Product Manager shared an exciting development on social media regarding the company's expansion into the UK market. After the success of their Direct OEM Shared PM service program in the United States, DIS took the program to the UK, marking a significant milestone. Engineers Mike Faraci and Steven Kissinger launched the initiative with several UK-based PCB manufacturers. The company's decision to extend this successful program across the pond aims to provide the same high-level service to its European customers.
DIS also highlighted a new partnership with a UK PCB manufacturer that recently acquired their advanced Pinless Optical Alignment Bonding Lay-Up system. This technology is expected to enhance the precision and reliability of PCB production. The company shared updates from several UK-based clients who have adopted DIS's innovative equipment, including Exception PCB Ltd, Zot Engineering Ltd, Graphic PLC, and GSPK Circuits Ltd.
Additionally, the company celebrated some impressive milestones in recent months. DIS's Pinless Optical Alignment Bonding system has surpassed the remarkable threshold of 1 million inner layers processed at Summit Interconnect (formerly ITL Circuits) in Toronto, Canada. Jacky and Irek, who have been operating and maintaining the DIS system for ovr a decade, continue to rely on the system's reliability and performance.
Another notable achievement came from APCT in Southern California, which joined the exclusive "1 Million Cores Club" after processing over 1 million inner layers through DIS's pinless system. APCT credits DIS technology for playing a key role in their success, particularly in delivering high-layer count, high-accuracy PCBs.
As DIS continues to expand globally, it remains committed to providing its clients with cutting-edge solutions that meet the ever-evolving demands of the PCB industry. With its new ventures in the UK and ongoing milestones in North America and China, DIS is positioning itself as a key player in advancing the future of PCB technology.
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