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Daeduck Electronics(35320K.KS), a pioneer in Korea's PCB (Printed Circuit Board) production since 1965, has announced the successful development of a large body FCBGA substrate for AI servers and data centers. With operations across Korea, Vietnam, and sales offices in the US, China, and Taiwan, the company has been a significant player in the global package substrate market.

Large Body FCBGA developed by Daeduck Electronics

Recently, Daeduck Electronics has shifted its focus towards Semiconductor Package Substrates, making a notable entry into the FCBGA (Flip Chip Ball Grid Array) market in 2021. This move has positioned them as a leading FCBGA manufacturer in Korea, making a significant impact on the market.

The FCBGA is a high-density semiconductor substrate that enhances electrical and thermal characteristics. Daeduck Electronics has made a mark in the FCBGA market for AI servers and data centers, previously dominated by companies in Japan and Taiwan.

Their large body FCBGA substrate, a cutting-edge substrate measuring 100mm x 100mm with 20 or more layers, is used in high-performance computing (HPC) chips, also known as data center chips. It can also be applied to CPUs, GPUs, and 2.5D packages like CoWoS (Chip on Wafer on Substrate) packaging used in AI servers. This development has enabled Daeduck Electronics to enter all product markets accessible through FCBGA.

Furthermore, Daeduck Electronics is gearing up to take on the next-generation packaging market by developing a technology that combines silicon capacitor embedding technology, bridge integration technology, and large body FCBGA substrate technology.

Young-Joo KO, CTO of Daeduck Electronics, stated, "As semiconductor technology rapidly evolves, we aim to expand our market share in next-generation markets such as AI and autonomous driving by collaborating with major global companies, leveraging our unique advanced technology."

Editor：Lulu

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