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Malaysian Prime Minister Anwar Ibrahim officially launched the first phase of Infineon Technologies’ 200mm silicon carbide (SiC) power semiconductor fabrication facility on August 8.

The new factory, which covers an area of 35 acres and has a roofed area of 60,000 sq m, is expected to create 4,000 new jobs, including 1,500 high-value positions.

Infineon has invested €2 billion (RM9.8 billion) in the first phase, with plans to invest an additional €5 billion (RM25 billion) in future expansion.

SiC chips offer improved efficiency and performance in electric vehicles, renewable energy systems, and data centers, thanks to their ability to operate at higher temperatures and voltages than traditional silicon chips.

According to Infineon CEO Jochen Hanebeck, the company is the world’s leading supplier of automotive semiconductors, and its role is becoming increasingly important in the renewable energy and data center sectors, particularly in the area of artificial intelligence.

Currently, data centers account for about 2% of global power consumption, and this is expected to rise to 7% by 2030. Solutions based on silicon, SiC or gallium nitride will be essential, Hanebeck said.

Hanebeck also acknowledged significant prepayments from several customers supporting the Kulim expansion, viewing them as a sign of trust and appreciation for the political support.

Infineon began its Malaysian operations in Melaka in 1973 and opened Asia’s first front-end fabrication plant in Kulim in 2006. Currently, Infineon employs more than 16,000 highly skilled workers in Malaysia.

Editor：Vicky

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