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South Korean company C&G Hi Tech Co., Ltd. announced on August 22 that it had developed key technology for manufacturing glass (PCB) printed circuit boards and filed a patent for this core technology on August 19.

The patented technology involves a proprietary surface treatment process that significantly improves adhesion between insulating glass and copper metal, achieving a bond strength exceeding 7N/cm. It also enables copper deposition and plating within the glass substrate’s holes, filling them to an aspect ratio of up to 1:5 without voids.

Glass substrates offer superior electrical, thermal, and physical properties compared to conventional materials, with extremely low surface roughness, making them ideal for fine circuit implementation. However, their smooth surface and high chemical resistance make metal adhesion challenging, complicating durable circuit creation.

While thicker glass can enhance strength, filling deep holes with metal for reliable through-glass vias (TGVs) remains difficult, limiting commercial use despite the potential.

C&G Hi Tech’s new surface treatment and deposition technologies, which aim for aspect ratios up to 1:10, address these challenges.

A company representative noted, "This patent is the result of ongoing R&D with industry and research partners. We aim to leverage our expertise to develop new products and lead the next-generation circuit board materials industry."

Editor：Lulu

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