Chinese PCB manufacturer Camelot Electronics has announced an investment of 2.3 billion yuan (approximately 320 million USD) to expand the production capacity for multi-layer rigid boards and high-density interconnect boards, with the project expected to add an additional 3 million ㎡ of space.
Camelot Electronics stated that the project will be carried out in three phases. The total construction period, planned to span 60 months, includes three phases. The first phase, estimated at 18 months, aims for completion and operation by July 2024, with a planned production capacity of 1.2 million ㎡. The second phase, with a construction period of 6 months, is expected to be operational by July 2026, also with a planned production capacity of 1.2 million ㎡. The third phase, scheduled for a 12-month construction period, is set to be operational by January 2028, with a planned production capacity of 0.6 million ㎡.
About Camelot
Camelot Electronics Technology Co., Ltd. (Former Camelot (Qing Yuan) Hytec Technologies Investment Limited Company) located in High-Tech Development Zone, Qingyuan City, Guangdong Province; specialized on the Print Circuit Board (PCB) research, production and sale; passed certifications of ISO9001, ISO14001, UL, CQC, IATF16949, ISO13485, ISO45001, GB/T29490, ISO50001, AEO Customs Advanced Certification, etc. Camelot also awarded the title of National High-tech Enterprise, China's Top 100 PCB Enterprise, and Print Circuit Board Engineering Technology Research and Development Center of the Guangdong Province.
Camelot was established in the year of 2006, started operation in the year of 2012, and was listed on the Shenzhen Stock Exchange Growth Enterprise Market in August 2022 (Stock name: Camelot; Stock Code: 301282); products mainly apply in automotive electronics (core components of intelligent electric vehicles, traditional automotive parts), communication electronics, energy storage and industrial control, consumer electronics, medical devices, etc; terminal clients include HUAWEI, ZTE, Siemens, Honeywell, ABB, etc. Camelot mainly focuses on automotive PCB market, and occupies a high market share with relatively strong competitive advantage especially in the intelligent electric vehicle PCB field; products are ultimately used in Tesla, BMW, Audi, Mercedes-Benz, NIO, Xiaopeng, Leading Ideal, Geely, Great Wall, Dongfeng, Changan,SAIC, Chery, JAC,Volkswagen, Toyota, Nissan,Stellantis, Hyundai, Yutong and other well-known automotive brand .
At present, Camelot has formed two production bases in Qingyuan of Guangdong and Anlu of Hubei, and plans to form PCB production capacity of total 8 million ㎡ per year. Production base in Qingyuan covers an area of 82 thousand ㎡，with a planning PCB production capacity of 4 million ㎡ per year. Production base in Anlu of Hubei (wholly owned subsidiary Camelot Hubei Technology Limited) covers an area of about 261 thousand ㎡, puts up with industry 4.0 concept to construct a PCB intelligent factory, plans to form an annual production capacity of 4 million ㎡ HDI (high-density interconnection) and rigid-flex PCB matching for high-end new energy automotive product.
Camelot aims to serve the technological changes and industrial upgrades, to provide high-quality PCB for the global electronics and emerging industries. adhering to the spirit of "united, hardworking, honest, enterprising, innovative, sharing", Camelot is committed to become the global new energy vehicle print circuit board field's first-class manufacturer and a well-known enterprise with strong competitiveness in the domestic PCB industry.
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