March 14, 2025 — Calumet Electronics (NASDAQ: CLMT), a Michigan-based leader in PCB and IC substrate manufacturing, is rapidly expanding its capabilities through two major projects: one enhancing HDI production and another building a state-of-the-art advanced packaging substrate facility. Together, these initiatives aim to position the company — and the U.S. electronics supply chain — at the forefront of next-generation technology for aerospace, defense, high-performance computing, and AI industries.

Boosting HDI Production with KLA’s Cutting-Edge Imaging Technology

On March 12, 2025, as part of its ongoing investment in high-density interconnect (HDI) and high-bandwidth data utilization (HBDU) manufacturing, Calumet integrated KLA Corporation’s Orbotech Diamond 10 LED Soldermask Imager into its existing production lines.

This advanced imaging system provides:

● 25μm high-resolution soldermask imaging for improved yield

● All-digital processing for greater accuracy and efficiency

● Scalability to handle high-resolution, complex designs

Calumet’s Chief Technology Officer, Meredith LaBeau, praised the Diamond 10’s performance:

"The imaging quality and high throughput on the Diamond 10 can handle even the most complex topographies. It’s fast, efficient, and incredibly accurate."

This enhancement supports Calumet’s mission to supply mission-critical sectors — including aerospace, defense, and high-performance electronics — with U.S.-manufactured, high-precision circuit boards.

New $51 Million Advanced Packaging Substrate Facility Nears Completion

On February 7, 2025, Calumet announced that construction of its 40,000-square-foot advanced packaging substrate factory — part of its 160,000-square-foot campus expansion — was nearing completion. This facility, expected to open in Q2 2025, will be the first of its kind in the U.S., producing high-performance IC substrates using:

● mSAP (Modified Semi-Additive Process)

● SAP (Semi-Additive Process)

● Embedded Technology (ET)

The project represents a $51 million investment, backed by $39.9 million from the U.S. Department of Defense under the DPA Title III program and $7.5 million from the Michigan Economic Development Corporation (MEDC).

Calumet stated:

"By bringing this technology to the U.S., we’re not only contributing to national and economic security but also setting a new standard for advanced manufacturing in America."

The new plant will focus on AI, high-performance computing, 5G/6G, edge computing, and advanced communications — sectors demanding higher speed, greater power efficiency, and compact designs that glass-based substrates can enable.

A Strategic, Long-Term Partnership with KLA

Calumet’s collaboration with KLA Corporation — a global leader in semiconductor process control — spans over 20 years. This latest effort brings together KLA’s advanced manufacturing technology with Calumet’s expertise in substrates and PCB production, ensuring American innovation and supply chain resilience.

The dual expansion projects, combining HDI advancements and advanced packaging capabilities, position Calumet to lead in next-generation electronics — while reinforcing the U.S.’s competitiveness in the global semiconductor race.