Nireco Corporation, a global leader in X-ray fluorescence (XRF) plating measurement, has announced an exclusive distributor agreement with U.S.-based Bowman Analytics, Inc. for their benchtop XRF thin-film measurement equipment. Bowman manufactures XRF devices designed for applications like electronic components, printed circuit boards (PCBs), and plating thickness measurements.

Nireco, which has been selling handheld XRF devices and has built up substantial expertise in the field, will now expand its offerings to include Bowman's benchtop XRF systems. This move strengthens Nireco's presence in the semiconductor, electronic components, and PCB markets.

Bowman, headquartered in Chicago, specializes in benchtop XRF measurement systems for a wide range of sample types and sizes. Their products perform non-destructive elemental analysis on materials from aluminum (Al) to uranium (U) and are widely used in thin-film, elemental, and plating analysis across sectors like electronics, PCBs, and jewelry. Featuring an intuitive user interface and advanced technology, Bowman's systems can focus X-rays down to the micrometer level, making them ideal for measuring semiconductor wafers, ball grid arrays (BGAs), and micro-solder bumps. Nireco will offer these systems to its customers in Japan’s electronics, PCB, and plating industries, along with the advanced semiconductor packaging sector.

With miniaturization reaching its limits, the semiconductor industry is focusing on multi-layered structures to enhance performance. Bowman’s high-resolution XRF systems, capable of measuring thin films and four layers of coating simultaneously, and up to five layers of film thickness, are expected to play a key role in the inspection of next-generation packaging substrates.

Nireco will begin selling and servicing Bowman’s XRF measurement systems in the semiconductor, electronic components, and PCB industries starting October 1, 2024.