Avantec offers its customers surface mount (SMT), ball grid array (BGA), through-hole, or mixed technology services to satisfy every requirement. Our surface mount line consists of automatic pick-and-place equipment from Philips* and Amistar. All through-hole assemblies are soldered using the Electrovert Econopack Wave Soldering System. All fluxes used in our assembly processes are water soluble, allowing all products to pass through various cleaning stages using the de-ionized aqueous water cleaning system.