American Standard Circuits (ASC), a leading player in the North American electronics industry, is making waves with its innovative technology for developing Printed Circuit Boards (PCBs) requiring ultra-high-density interconnects. The company has been an early licensee of Averatek Corporation's patented A-SAP™ Technology, which has enabled ASC to produce ultra-fine lines and spaces in any board technology, including rigid, flex, and rigid-flex.

ASC's Ultra High-Density Interconnect program has been designed to offer several design advantages, including size and weight reduction, tight spacing and impedance control, reduced layer count, and improved signal integrity. The program's aspect ratios are greater than 1:1 for metal traces, and its RF performance is better than traditional subtractive-etch processes. Additionally, ASC's technology allows the use of biocompatible materials such as gold and other noble metals, thereby reducing costs, especially for complex, high-performance boards.

Currently, ASC builds down to 20 microns (0.8 mils) trace and space with 12.5 microns (0.5 mils) trace and space available later this year. However, the company plans to further step down into the 15-micron range in 2023. ASC's Ultra High-Density Interconnect program offers several capabilities, including sub-25 micron lines and spaces, available on board types such as rigid, flex, and rigid-flex, and all material types. The program also offers hybrid constructions using ultra-fine line features on select layers and standard technology on others, micro vias to 75 microns with copper filling, and tight impedance tolerances, resulting in improved signal integrity.

ASC's innovative technology is set to revolutionize the electronics industry, as it offers significant design advantages, reduced costs, and improved performance compared to traditional subtractive-etch processes. With the company's plans to further step down into the 15-micron range, the future looks promising for ASC and its Ultra High-Density Interconnect program

Click here to read more about ASC's UHDI program.

● About ASC

ASC is a Total Solutions Provider for the PCB industry, capable of delivering simple to advanced technology to virtually every industry sector in quantities ranging from quick prototypes to large volume production.

Founded in 1988, American Standard Circuits is a leading manufacturer of circuit board solutions worldwide.

ASC's ongoing commitment to leading-edge higher-level interconnect technology, cost-effective manufacturing and unparalleled customer service has put us at the forefront of advanced technology circuit board fabrication.  

ASC manufacture quality rigid, metal-backed,  flex and rigid-flex printed circuit boards on various types of substrates for a variety of applications including:

• Military/Aerospace

• Industrial

• Commercial

• Medical

• Telecommunications

• Consumer Electronics

• RF/Microwave

• Transportation

Advanced Technology

ASC's ongoing R&D work in both thermal management and embedded passive components allows us to keep up with ever-increasing complexity, various clock speeds, power consumption, and heat output computing devices. Our specialties include hybrid circuits (made from multiple materials), exotic materials, blind and buried vias, flex, rigid-flex , and thermal management solutions (for which we hold several patents). Learn more»

Quality

ASC has state-of-the-art process control systems and our certifications include AS9100 Rev D, ISO 9001:2015,  MIL PRF 31032 and MIL PRF 50884F. We have rigorous SPC controls, automated optical inspection, metallographic cross-section and electrical test facilities. These provide the quality assurance needed to meet the high standards of our customers. Learn more»

Quick Turns

We have developed the ability to provide quick turns for all the technologies that we manufacture. Our world-class front-end engineering (CAM) systems and processes, coupled with our rapid-response manufacturing processes, enable us to provide quick-turn options for our customers. Learn more»