AmTECH Microelectronics was established over 30-years ago by a core team of Silicon Valley professionals. The team’s roots coming from design for manufacturing and process development of Hybrid Circuits, Multi-Chip Modules (MCM), 2.5D & 3D Heterogeneous Integration, Chip-On-Board (COB), Chip-On-Flex (COF), PCB and RF Assembly. AmTECH processes include, flip chip C4 & TCB, die attach, wire  bonding, ribbon bonding, dispense & encapsulation, and Surface Mount Technology (SMT).