AMD has been granted a significant patent (12080632) for its glass core substrate technology, which marks a pivotal step toward the company’s plans to use glass substrates in ultra-high-performance system-in-package (SiP) designs starting around 2026. This patent ensures that AMD can pursue this technology without the risk of legal challenges from patent trolls or competitors.

The new glass substrates are designed to replace traditional organic substrates in multi-chiplet processors, a shift that could have a profound impact on the future of chip manufacturing. Glass materials like borosilicate, quartz, and fused silica offer several advantages over organic substrates. These include exceptional flatness, dimensional stability, and superior thermal and mechanical stability, making them ideal for high-performance applications like data center processors. Glass substrates also provide better thermal management and can handle high temperatures without deforming, which makes them suitable for demanding environments.

However, working with glass substrates comes with challenges, one of which is the creation of Through Glass Vias (TGVs)—vertical pathways within the glass that transmit data and power. AMD’s patent outlines methods for producing these vias using techniques such as laser drilling, wet etching, and magnetic self-assembly, the latter of which is still a developing technology. Another important element of AMD’s design is the redistribution layer, which routes signals and power between chips and external components using high-density interconnections. Unlike the main glass core, these layers will still use organic dielectric materials and copper, but will be built on the glass substrate’s surface.

The patent also describes a novel method for bonding glass substrates together using copper-based bonding rather than traditional solder bumps. This new bonding technique ensures gap-free, reliable connections, and eliminates the need for underfill materials, making it more suitable for stacking multiple substrates.

AMD’s move into glass substrates comes as the wider semiconductor industry, including competitors like Intel and Nvidia, explores similar technologies. Glass substrates could enable future processors to handle higher-density interconnects, enhancing signal routing and electrical isolation, and even supporting optical signal integration for high-speed data transmission. As part of its research into this technology, AMD is positioning itself to lead the charge in next-generation chip packaging, with plans to integrate glass substrates into its products by 2025-2026.

The development is also in line with the broader semiconductor industry’s push toward glass substrate adoption. Intel plans to begin mass production of glass-based chips as early as 2026, and companies like Samsung and LG Innotek are making significant strides in this area. The increasing demand for high-density interconnects in data centers and mobile devices makes the glass substrate technology crucial for the future of advanced electronics.

AMD’s patented innovations could transform how processors are designed, enabling more efficient, higher-performing chips and setting a new standard for the industry.