AMD has signed a $3 billion deal with Samsung for 5th Generation HBM3E memory, enhancing AI accelerators and boosting memory capacity,  Korean media reports on April 24.

The new MI350 datacenter chips will have 30% more memory bandwidth than the MI300, rivaling Nvidia's offerings.

The agreement secures a strong memory supply for AMD and benefits Samsung's memory sales, amid rising demand for non-Nvidia AI products.

AMD's upcoming CES 2024 keynote, which is expected to include major AI announcements, may not be sufficient to challenge Nvidia's dominant market position.

Editor：Lulu

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