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AKC Co., Ltd. has officially entered the semiconductor glass substrate inspection market, successfully delivering equipment for inspecting Through Glass Vias (TGVs), crucial for glass substrate performance. This marks its entry into the next-generation semiconductor substrate market. AKC is a manufacturer of semiconductor packaging inspection equipment.

AKC TGV Inspection Equipment for Semiconductor Glass Substrates, PAVIS-50TGV

On July 14th, AKC announced the delivery of its high-performance TGV inspection equipment, the 'PAVIS-50TGV,' to JOONGWOO M-TECH CO.,LTD. This is the first delivery since AKC secured TGV inspection technology at the end of last year.

AKC's equipment combines advanced optical and packaging inspection technologies to swiftly and accurately detect defects inside TGV holes. Unlike existing equipment, which struggles to inspect all parts of TGV holes simultaneously, AKC’s equipment can inspect the entire hole by examining only the upper part. This achievement uses patented technology co-developed by AKC and JOONGWOO M-TECH.

A company representative stated, "Our technology has received positive feedback for minimizing defects in glass substrates, overcoming limitations of existing inspection equipment. We expect to enhance productivity through high accuracy and reduced inspection time."

AKC recently delivered TGV inspection equipment for semiconductor glass substrates to JOONGWOO M-TECH

JOONGWOO M-TECH will use AKC’s equipment to inspect TGV-related products from 4-inch wafers to 510×515mm glass panels. They will supply glass substrates to leading substrate and semiconductor packaging companies in South Korea, Taiwan, Europe, and Japan. JOONGWOO M-TECH handles TGV processing within the semiconductor glass substrate supply chain.

AKC plans to aggressively target the next-generation semiconductor substrate market with its TGV inspection equipment. Alongside their high-resolution color laser via hole inspection equipment developed last year, they aim to drive new growth and lead the advanced packaging inspection market through continuous innovation.

Jongro Lee, CEO of AKC, stated, "We expect our TGV inspection equipment to significantly advance the semiconductor glass substrate packaging industry. We will support our customers in producing higher quality glass substrate packaging products through our innovative technology."

About AKC Co., Ltd.

Since 1994, AKC Co., Ltd. has been supplying essential equipment for PCB manufacturing processes, specifically automatic exposure machines, within South Korea. Our company has achieved rapid growth by leveraging excellent technical skills and customer-focused, prompt, and accurate services, establishing strategic partnerships with the country’s top PCB companies.

Editor：Lulu

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