Additive Circuits Technologies (ACT) develops and implements proprietary technologies for applying a wide range of conductive materials to novel and advanced dielectric surfaces.

The Company provides critical solutions for advanced technology interconnects for the Defense, Aerospace, and Telecommunications markets.  Applications encompass Radio Frequency and Microwave transmissions, High Density Interconnects that support ultra-fine pitch BGAs, Waveguide structures, and planar and non-planar antennas.

The Company’s expertise is comprised of the development and implementation of advanced additive metallization methodologies, and the design and engineering of capital equipment, automated and semi-automated equipment lines.

Additive Circuits’ unique solutions deliver controlled additive metallization capabilities in x, y, and z-axis.  The precise conductor geometries can be built up to ultra-thin depositions where advantageous, in both planar and non-planar applications.  Conductor width resolutions are within .00025” tolerances with line and space specifications down to .001”.  The improvements result in high performance circuitry with optimized signal integrity and minimized loss, higher board densities and improved routing options, potentially reduced layer counts, and higher manufacturing yields.