We specialize in the design and manufacturing of printed circuit board assemblies, custom box build solutions, end-of-life re-engineering and PCB design/engineering. Our capabilities provide complete turnkey solutions from quick turn / low volume to production volume. We employ a mix of technologies including through hole (THT) and surface mount (SMT) and placing all package types including ball grid array (BGA). Our equipment includes three SMT Lines, Wave Solder, Selective Solder, DI Wash and Conformal Coat Services.