According to the latest statistics released by the Japan Electronics Packaging Circuits Association (JPCA), the output of printed circuit boards (PCBs) in Japan, including rigid PCBs, flexible PCBs, and module substrates, in April 2023 decreased by 19.8% from the same period last year to 790,000 square meters and has been declining for 15th consecutive months. The revenue dropped sharply by 24.7% to JPY 45.189 billion, which has been declining for 6 consecutive months and has reached the largest decrease in nearly ten years.

In terms of category, the output of printed circuit boards (PCBs) in Japan for April 2023 showed a decline in rigid PCBs, with output dropped by 17.5% to 647,000 square meters, marking the 14th consecutive month of decline, while the revenue for rigid PCBs decreased by 26.1% to JPY 28.534 billion, which has been declining for the 8th consecutive month;The output of flexible PCBs dropped by 22.4% to 99,000 square meters, marking the third consecutive month of decline in four months, while the revenue for flexible PCBs decreased by 19.4% to JPY 1.988 billion, which has been declining for the 6th consecutive month;The output of module substrates dropped sharply by 40.1% to 43,000 square meters, marking the 11th consecutive month of decline, while the revenue for module substrates decreased by 22.5% to JPY14.667 billion, which is the first time of decline in three months.

From January to April 2023,the output of PCBs in Japan decreased by 14.2% from the same period last year to 3.33 million square meters, and the revenue decreased by 14.3% to JPY 195.075 billion. Among them, the output of rigid PCBs decreased by 12.5% to 2.745 million square meters, and the revenue decreased by 19.2% to JPY 11.8298 billion;The output of flexible PCBs decreased by 10.6% to 426,000 square meters, and the revenue decreased by 10.6% to JPY 8.932 billion; The output of module substrates dropped sharply by 40.0% to 158,000 square meters, while the revenue decreased by 4.8% to JPY 67.845 billion.