On June 27th, YMT Co., Ltd.(KOSDAQ:251370)held a groundbreaking ceremony for its R&D center（research and development center）located in Songdo, South Korea.

With a total floor area of 25,874 square meters, including one basement level and six above-ground levels, the R&D center is slated for completion in 2025 and serve as a specialized laboratory for YMT's varied business ventures in the field of electronic components, covering chemical materials and copper foil.

YMT, listed on the KOSDAQ, specializes in chemical materials and copper foil used in the manufacturing process of printed circuit boards (PCBs), which are essential components of the electronic industry. The company's products are crucial foundational materials in the field of electronic components, used in various applications such as smartphones for Apple and Samsung, electric vehicles, and 5G communication chips. It is worth noting that YMT has outstanding technology in the gold plating and copper plating markets, with the potential for successful localization. Additionally, YMT has developed ultra-thin copper foil using chemical plating techniques, breaking the monopoly of the ultra-thin copper foil market by Japanese companies.

Jeon Seong-wook, the CEO of YMT, stated, "I am delighted to establish a new R&D center in Songdo because I believe that securing world-leading technology is the only way to survive in the domestic chemical materials field, where advanced countries still hold a high market share. We will strive to make a significant contribution."